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Lite Etching System (TSL3000)

Product Detail Information
  • Profiler is a new generation Multi-Application system that performs Pattern Profiling and Plasma Oxide Dry Cleaning (POC) utilizing a Point Inductively Coupled Plasma (PICP) source for semiconductor manufacturing under the <3Xnm design processes. It supports a wide process window utilizing chuck & baffle temperature controls, high & low Etch Rates (50~600/min), and good wafer Uniformity (<3.0%) Performance, low particle control, and outstanding reliability make the profier a highly attractive and effective low-cost solution for various application purpose.