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300mm Dry Cleaning System (ZIVIS II)

Product Detail Information
  • ZIVIS II is a high volume production Plasma Oxide Cleaning (POC) system for processing 300mm wafers. A dry cleaning solution is implemented to overcome the disadvantages of using the wet cleaning process, in which dry cleaning is becoming more critical in areas where semiconductor manufacturing technology is becoming more complex and minute. Zivis II is designed to meet the semiconductor industry standards for cleaning processes. It has delivered more consistent results while maintaining the safety threshold for particles when compared to batch type systems. The new POC system also has a cassette loadlock that can hold up to 25 wafers, and a dual pick-up/down robot for increased productivity.